Five Teams Advance to Final Round of $1.75M Water Abundance XPRIZE

Teams from U.S., India, U.K. and Australia Move Forward in Competition Aimed at Tackling Global Water Scarcity

LOS ANGELES--(BUSINESS WIRE)--Today, in honor of World Water Day, XPRIZE – the world’s leader in designing and operating incentive competitions to solve humanity’s grand challenges – announced the five finalist teams advancing in the $1.75M Water Abundance XPRIZE, a two-year competition aimed at tackling global water scarcity.

Sponsored by Australian Aid and the Tata Group, the Water Abundance XPRIZE incentivizes teams from around the world to create and develop pioneering technologies that can extract a minimum of 2,000 liters of water per day from the atmosphere using 100 percent renewable energy, at a cost of two cents per liter.

“Water is our lifeblood. With alarming water shortages impacting livelihood around the world, we are in dire need of decentralized and democratized water breakthroughs now more than ever,” said Zenia Tata, vice president of Global Impact Strategy at XPRIZE. “The promising prototypes presented by these five finalist teams bring us one step closer towards finding a cost-effective solution for extracting water from thin air and offering on-demand access to water, anytime and anywhere.”

The five finalists were chosen based on submissions of technical documentation, test results, and video of a solution prototype that can extract water from the atmosphere using any source of energy and without any requirement for minimum water output cost per liter. The finalists include startups, professors, professional scientists and engineers. The five finalists will share a $250,000 milestone prize purse.

The five advancing teams are:

  • Hydro Harvest Operation (Newcastle, Australia) – Led by the University of Newcastle’s Professor Behdad Moghtaderi, the team is going back to basics to develop a simple, energy-efficient and cost-effective device – giving communities worldwide the ability to harvest their own fresh water.
  • JMCC WING (South Point – Island of Hawaii) – Led by James McCanney, M.S., the team is powering the JMCC WING, LLC line of industrial Atmospheric Water Generators (AWGs) with the JMCC WING, a high efficiency wind energy system, to extract water from the atmosphere.
  • Skydra (Chicago, IL) – Led by Jacques Laramie, Nathan Taylor, and Chris Wlezien, the team has employed a hybrid solution that utilizes both natural and engineered systems to condense water out of the air.
  • Uravu (Hyderabad, India) – Led by Swapnil Shrivastav, the team is developing a completely off-grid water from air device, spinning together the magic of material sciences and solar thermal energy.
  • The Veragon & ThinAir Partnership (London, United Kingdom) – Led by Laura Dean, the team has developed a partnership with the key objective of revolutionizing the capability of Atmospheric Water Generators to deliver high quality, mineralized drinking water at the point of need, in an economically and environmentally sustainable manner.

The Water Abundance XPRIZE finalists were chosen from a field of 98 teams by an international and independent judging panel of seven industry experts in mechanical engineering, water treatment, ocean energy, strategic design and emerging technologies. Judges include: Mike Claerhout, RGL Reservoir Management; Nicholas Davis, World Economic Forum; David Ginley, Ph.D., National Renewable Energy Laboratory; Eric Hoek, Ph.D., Water Planet; David Ireland, Ph.D., ThinkPlace; Purnima Jalihal, Ph.D., National Institute of Ocean Technology, India; and Matthew Stuber, Ph.D., University of Connecticut and WaterFX.

The finalists will begin round 2 testing in July 2018 at a location to be determined. During this phase, teams must fully demonstrate that their device can extract a minimum of 2,000 liters of water per day from the atmosphere using 100 percent renewable energy, at a cost of no more than two cents per liter. At the end of this testing phase, the team whose solution enables the greatest ability to create decentralized access to water - giving people the power to access fresh water whenever and wherever they need it - will receive the Grand Prize of $1.5 million, to be announced in August 2018.

For more information about the competition structure, important dates, and the finalist teams please visit


XPRIZE, a 501(c)(3) nonprofit, is the global leader in designing and implementing innovative competition models to solve the world’s grandest challenges. XPRIZE utilizes a unique combination of gamification, crowd-sourcing, incentive prize theory, and exponential technologies as a formula to make 10x (vs. 10%) impact in the grand challenge domains facing our world. XPRIZE’s philosophy is that—under the right circumstances— igniting rapid experimentation from a variety of diverse lenses is the most efficient and effective method to driving exponential impact and solutions to grand challenges. Active competitions include the $30M Google Lunar XPRIZE, the $20M NRG COSIA Carbon XPRIZE, the $15M Global Learning XPRIZE, the $10M ANA Avatar XPRIZE, the $7M Shell Ocean Discovery XPRIZE, the $7M Barbara Bush Foundation Adult Literacy XPRIZE, the $5M IBM Watson AI XPRIZE, the $1.75M Water Abundance XPRIZE and the $1M Anu and Naveen Jain Women’s Safety XPRIZE. For more information, visit


In 2015, the Australian Department of Foreign Affairs and Trade’s innovationXchange (iXc) was launched by Foreign Minister Julie Bishop to deliver valuable outcomes for Australia’s aid program through the testing and piloting of new technologies, methodologies, and partnerships. The iXc ensures the lessons learned from these approaches are shared to support current and planned DFAT programs and shape regional and global forums on development innovation as well as to support innovative approaches across the department’s work.


Founded by Jamsetji Tata in 1868, the Tata Group is a global enterprise, headquartered in India, comprising over 100 independent operating companies. The group operates in more than 100 countries across six continents, with a mission ‘To improve the quality of life of the communities they serve globally, through long-term stakeholder value creation based on Leadership with Trust’. There are 29 publicly-listed Tata enterprises with a combined market capitalization of about $116 billion (as of March 31, 2016). Tata companies with significant scale include Tata Steel, Tata Motors, Tata Consultancy Services, Tata Power, Tata Chemicals, Tata Global Beverages, Tata Teleservices, Titan, Tata Communication and Indian Hotels.

For more information, please visit:


Jackie Wei, 310.741.4918

UnionPay International Forges Major Strategic Alliance with ACI Worldwide to Grow Global Footprint

UnionPay International boosts card acceptance globally with ACI, expanding its number of payment endpoints and accelerating the roll-out of new payment services

NAPLES, Fla. & SHANGHAI--(BUSINESS WIRE)--#eCommerce--ACI Worldwide (NASDAQ: ACIW), a leading global provider of real-time electronic payment and banking solutions, today announced a key strategic partnership with Shanghai-based bank card company UnionPay International. UnionPay International is set to significantly grow its worldwide footprint by connecting to ACI’s extensive global network of payment endpoints. Additionally, ACI provides UnionPay International with a next-generation foundational platform through which a range of new products and services can be rapidly brought to market.

UnionPay International (UPI), a wholly-owned subsidiary of China UnionPay, focuses on the growth and support of UnionPay’s global business. UnionPay now serves the world’s largest cardholder base of more than 7 billion UnionPay cards issued worldwide, and is the preferred payment brand for outbound Chinese travelers. ACI’s extensive network of payment endpoints – in particular, card acquirers that are integrated with its Universal Payments solutions, will allow UnionPay to rapidly expand its footprint and increase card acceptance, in both in-store and card-not-present environments.

ACI’s UP solutions also enable UnionPay International to innovate in the fast-growing mobile payments space. UnionPay, through its ACI implementation, is preparing to accelerate the roll-out of new payment services for online and mobile payments. ACI’s strong global presence, including its connections to more than 400 alternative payment methods and card acquirers, will facilitate the timely rollout of new tokenization-backed mobile solutions.

“Since the start of this year, UnionPay has been focused on expanding our business by coming up with innovative ideas, collaborating with new organizations, and operating using new go-to-market strategies,” said Mr. Cai Jianbo, CEO, UnionPay International. “This partnership is of great significance as it promotes cooperation in the development of our overseas business. Organizations and merchants have transformed their systems and can now rely on ACI’s business and technical strength in the global financial sector to further accelerate the development of innovative products. We can respond faster to our customers’ needs and increase the efficiency of our business operations.”

“We are proud to partner with an industry leader such as UnionPay to serve the payment preferences of its customers through ACI’s expansive reach, and loyal customer base of merchants and financial institutions. And with the extensive capabilities delivered by our UP solutions, we are uniquely qualified to support UnionPay’s diverse needs, long-term growth and global ambitions,” said Dan Frate, Group President, ACI On-Demand, ACI Worldwide. “UnionPay’s growth opportunity is considerable, with Chinese consumers now making more than 100 million trips outside of Greater China annually, and this number is expected to increase substantially.”

About ACI Worldwide

ACI Worldwide, the Universal Payments (UP) company, powers electronic payments for more than 5,100 organizations around the world. More than 1,000 of the largest financial institutions and intermediaries, as well as thousands of global merchants, rely on ACI to execute $14 trillion each day in payments and securities. In addition, myriad organizations utilize our electronic bill presentment and payment services. Through our comprehensive suite of software solutions delivered on customers’ premises or through ACI’s private cloud, we provide real-time, immediate payments capabilities and enable the industry’s most complete omni-channel payments experience. To learn more about ACI, please visit You can also find us on Twitter @ACI_Worldwide.

© Copyright ACI Worldwide, Inc. 2018.

ACI, ACI Worldwide, ACI Payment Systems, the ACI logo, ACI Universal Payments, UP, the UP logo, ReD, PAY.ON and all ACI product names are trademarks or registered trademarks of ACI Worldwide, Inc., or one of its subsidiaries, in the United States, other countries or both. Other parties’ trademarks referenced are the property of their respective owners.

Product roadmaps are for informational purposes only and may not be incorporated into a contract or agreement. The development release and timing of future product releases remains at ACI’s sole discretion. ACI is providing the following information in accordance with ACI's standard product communication policies. Any resulting features, functionality, and enhancements or timing of release of such features, functionality, and enhancements are at the sole discretion of ACI and may be modified without notice. All product roadmap or other similar information does not represent a commitment to deliver any material, code, or functionality, and should not be relied upon in making a purchasing decision.


ACI Worldwide
Dan Ring, +1 781-370-3600
Christopher Taine, +49 (0) 89 45230 557

Alef Mobitech Adds Mobile Industry Veteran Mike Mulica to its Board

MORRISTOWN, N.J.--(BUSINESS WIRE)--Alef Mobitech (Morristown, New Jersey, USA) a Mobile Edge Technology pioneer, today announced mobile industry leader, Mike Mulica, as the newest addition to the company’s board of directors.

“Mike Mulica is without doubt among the most influential and insightful new technology market makers in mobile on the planet today,” said Dr. Ganesh Sundaram, Alef Mobitech’s CEO. “We value his impressive track record of identifying and working with the top innovators driving the future of the Mobile Internet. With his expertise being added to Alef Mobitech’s Board, we look forward to building even greater momentum as an industry enabler in the months ahead.”

As a mobile and internet industry veteran, Mulica has played a foundational role in pioneering the Mobile Internet. He has been at the helm of many successful emerging technology product introductions across the globe, and played key leadership roles at companies that have changed the way the world works including: Synchronoss, Openwave,, RealNetworks, Actility, and most recently The IOT Co-op.

“With its roots from Bell Labs and 60+ core mobile network patents to its credit, Alef Mobitech’s technology team started building a highly distributed mobile-edge computing platform years before the world knew it needed one. What is available now in Tier 1 Mobile Operator production networks may be the most important economic lever available to the Mobile Carrier CEO and CFO today,” said Mulica. “By partnering with Alef Mobitech, Mobile Network Operators (MNOs) can create 5G capabilities over their existing 4G and legacy 3G networks without need for costly upgrades. This means they can postpone billions in spending while creating entirely new avenues for growth. I am thrilled to be part of this brilliant team enabling next generation mobile capabilities at a fraction of the cost of wholesale network deployment alternatives.”

Through its patented technologies and hyper-distributed cloud computing at the mobile network’s radio edge, Alef Mobitech, efficiently and cost effectively makes mobile networks smarter, faster, sharper, and able to handle the global marketplace’s increasingly growing demands for AR, VR, high-definition video, Smart Cities, IOT, and AI.

About Alef Mobitech

Alef Mobitech’s vision is to realize the full potential of the Global Mobile Internet through a wide range of enablement services. Based on innovative Mobility Cloud Technologies, Alef Mobitech empowers businesses across multiple segments to launch new digital mobility products and services.

Alef Mobitech has its headquarters in Morristown, New Jersey, with Offices in India and Brazil. For more information, please visit


for Alef Mobitech
Amy Hesser

FileCloud Expands to India, Announces Strategic Partnership with BESTIR

Mobile-First Indian Market Sees Increased Demand for Multi-Cloud Enterprise File Sharing & Collaboration

AUSTIN, Texas--(BUSINESS WIRE)--#CloudStorage--FileCloud, a leading cloud-agnostic Enterprise File Sharing and Sync (EFSS) platform, today announced its partnership with BESTIR Software Services in India. FileCloud and BESTIR are partnering in order to combine best-in-class technology and services, transforming file services and collaboration within organizations in India.

"One of our biggest advantages is that FileCloud integrates with existing infrastructure and file systems, hence our customers don’t have to change their existing business processes and workflows," said Madhan Kanagavel, CEO, CodeLathe. “Users can access files locally the same way they’ve always done. Additionally, they get cloud access when they want to access files remotely. FileCloud helps companies to leverage existing infrastructure and offers the best ROI across the industry.”

In today’s mobile-first India, employees and customers want to access, edit and collaborate on files from any device. The majority of companies in India are still using archaic solutions such as FTP or other consumer-grade file services to store and share sensitive business files. FileCloud is the ideal choice to serve the end-to-end external and internal file-sharing and collaboration needs of Indian enterprises. Importantly, FileCloud supports multi-cloud environments by allowing customers to store their data on the infrastructure of their choice across public, private or hybrid clouds.

With this new partnership, Indian customers will experience the control, security and privacy of FileCloud, as well as the local support and technology services of BESTIR. With just a few clicks, FileCloud helps IT administrators configure user settings, integrate branch office file servers, manage policies and deploy apps across any large organization. Some of the reasons why enterprises prefer FileCloud over other enterprise file sharing and sync solutions include:

  • Administrator Tools: Offers effective tools to deploy and manage thousands of users and millions of files. Customers can get unique insights such as usage trends, access by geo and content mix on their business.
  • Customization: Organizations can customize FileCloud to reflect their brand. No other competing enterprise file sharing and sync product can match FileCloud's branding options.
  • Data Leak Prevention: Includes real-time monitoring of employee devices and actions with a detailed audit trail. Offers capabilities to prevent data loss and detect security threats.
  • Security: Comes with industry-leading security features including 2FA, encryption, Anti-Virus scanning and custom policies.
  • Ransomware Protection: FileCloud’s heuristic file content scanning engine helps administrators to detect and block ransomware.

“The partnership will open a new dimension of world-class services for organizations and enterprises in India,” said BESTIR Founder Anand Subramanian. “We are excited to bring a top-class technology enterprise file services platform to India. FileCloud is steeped in innovation and known for its customer support. With our deep experience in software development and services in India, we understand the unique needs of enterprises and government organizations. Our goal is to ensure that the leading Indian organizations can take advantage of the best that FileCloud has to offer.”

FileCloud is deployed across 90 countries and has more than 100 VARs and Managed Service Providers across the world. FileCloud is used by Fortune 500 and Global 2000 firms, including the world’s leading law firms, government organizations, science and research organizations, and world-class universities. Find out more by visiting and


BESTIR Software Services is an Indian-based end-to-end IT company that delivers business organizations with integrated solutions to make business more efficient, agile, customer-centric and market focused. Specializing in the design, development and implementation of complex enterprise solutions that employ a 100 percent offshore model, BESTIR has delivered hundreds of projects throughout the U.S., the UK, Australia and India. For more information, please visit:

About FileCloud

FileCloud is based in Austin, Texas, and is a developer of unified, secure enterprise file service platform that organizes enterprise data, enhances collaboration and productivity, while providing ironclad data protection. FileCloud’s file sharing solutions offer powerful file sharing, sync, and mobile access capabilities on public, private and hybrid clouds. The company offers two products—Tonido for consumers, and FileCloud for businesses—that are used by millions of customers around the world, ranging from individuals to Global 2000 enterprises, educational institutions, government organizations, and managed service providers. For more information, visit


Michael Kellner, 512-960-8222

German Company Develops New Solution for Monetizing News Content

Newspapers and readers both benefit from blockchain based solution

FRANKFURT, Germany--(BUSINESS WIRE)--MulTra GmbH has created an innovative solution to monetize digital content for newspaper publishers while simultaneously paying consumers for reading the news through their Pumped App. Pumped claims to be the first platform which pays people for reading news content while guaranteeing 100% ad revenue to publishers at no-sign up cost.

“We developed the Pumped App working with feedback from major international publishers to address the challenge of monetizing news content,” said MulTra GmbH CEO Onik Mia. “By using the Pumped App, consumers are paid in the Ethereum-based MulTra Token (MTT) to read publisher content and earn cryptocurrency.” MulTra GmbH is a member of the Enterprise Ethereum Alliance.

The Pumped App is platform independent and any publisher, regardless of size, can participate in the Pumped ecosystem for free. Media industry leaders and blockchain experts recently gathered at the Soho House Berlin to discuss how Pumped can increase monetization of content independent of the Google / Facebook duopoly. They agreed that the integration of blockchain technology and crypto-micropayments can create exciting monetization opportunities for news publishers.

The Pumped App learns what types of content a user is interested in and provides more curated content to the user using machine learning. Readers are then paid with MTT for reading, curating and engaging with the news content on the Pumped App. These earned MTT can then be exchanged for money through cryptocurrency exchanges or can also be used to pay for premium content subscriptions on publisher websites, hence providing an additional revenue source to newspapers.

This allows people anywhere in the world to earn money for reading the news.

About Enterprise Ethereum Alliance (EEA): The EEA connects Fortune 500 enterprises, startups, academics and technology vendors with Ethereum subject matter experts.

About MulTra GmbH: MulTra GmbH, the company that has developed the Pumped ecosystem, was founded in 2014 and is based in Frankfurt, Germany. Its clients include Deutsche Bank, Samsung, Huawei, BMW, GlaxoSmithKline, Lenovo, Johnson & Johnson and many more. MulTra GmbH’s digital products received multiple awards from the European Commission for their innovative strengths and impactful nature. Website:

*Source: AETOSWire


MulTra GmbH
Saif Qazi, +496934877311, +97433839215
Chief Marketing Officer

ASE Announces Recipients of the 2017 ‘Outstanding Supplier’ and ‘Excellence in Sustainability’ Awards

KAOHSIUNG, Taiwan--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc (TAIEX: 2311, NYSE: ASX), a leading semiconductor assembly and test service provider, today hosted the ASE Group supplier award ceremony. Each year, the ceremony endeavors to honor exceptional suppliers for outstanding performance in categories such as technology, quality, cost and service.

In total, seventeen suppliers received an ‘Outstanding Supplier’ award while three companies received an ‘Excellence in Sustainability’ award. The ceremony was attended by over 420 representatives from 125 companies worldwide supplying equipment, raw material, engineering contracts, environmental and waste management, logistics and various products and services to ASE. Held annually in Kaohsiung, Taiwan, the annual awards ceremony continues to receive high level support from the government, local academia, international consulting firms and related industry associations.

“Technology is advancing faster than ever and clearly driving the semiconductor industry to develop next generation applications in areas such as robotics, artificial intelligence, virtual reality, Internet of Things and advanced driver assistance systems,” said Dr. Tien Wu, Chief Operating Officer and Chairman of the Corporate Sustainability Committee, ASE Group. He continued, “Our industry is built on efficiencies that improve cost and on innovations that enhance the value of the entire ecosystem. Successful alignment with suppliers is fundamental in our delivery of leading edge IC packaging and system solutions that meet new technology requirements. At ASE, we remain committed to long term partnerships for a win-win sustainable future.”

“Excellence in supplier performance is paramount to our business success and we sincerely congratulate all the award winners. This year, as we ‘Gear towards a Sustainable World,’ ASE is blazing a trail in setting new supply chain standards. We are reaching out to key market segment players throughout the entire semiconductor supply chain to encourage collaboration that promotes transparency and sustainability in the industry,” said S.S. Lee, General Manager, ASE Corporate Procurement.

The annual supplier event will also include a talk on ‘Climate Change Mitigation’ that will present audiences with the challenges and opportunities faced by businesses and how the industry can help shape policies to reduce harmful environmental impacts.

The following is the list of the award winners for the year 2017.

ASE Group Outstanding Supplier Award

Acter Co Ltd
All-Ring Tech Co Ltd
Applied Materials South East Asia Pte Ltd
Daeduck Electronics Co Ltd
Henkel Electronic Materials LLC
Hitachi Chemical Co Ltd
Hon. Technologies Inc
Kulicke & Soffa Pte Ltd
Lam Research Co Ltd
Mi Equipment (M) Sdn Bhd
Mitsubishi Gas Chemical Company Inc
Murata Electronics Trading (Shanghai) Co Ltd
Shinko Electric Industries Co Ltd
Small Precision Tools
Tanaka Denshi Group
Tokyo Electron Ltd
Upper Odyssey Technology Sdn Bhd

ASE Group Excellence in Sustainability Award

Samsung Electro-Mechanics Co Ltd
Senju Metal Industry Co Ltd
Shinko Electric Industries Co Ltd

About The ASE Group

The ASE Group is among the leading providers of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever-growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through USI Inc and its subsidiaries, members of the ASE Group. For more information about the ASE Group, visit or twitter @asegroup_global.

Safe Harbor Notice

This press release contains “forward-looking statements” within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. Our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied in these forward-looking statements for a variety of reasons, including risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the uncertainties as to whether we can complete the share exchange contemplated by a joint share exchange agreement between Siliconware Precision Industries Co., Ltd. and us; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent global economic crisis; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors. For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including our 2016 Annual Report on Form 20-F filed on April 21, 2017.


ASE Group
Patricia MacLeod
Jennifer Yuen

Hitachi High-Technologies Develops Enhanced Microwave ECR Etching Module

Achieves Damage-Free Atomic-Level Etching with a Wide Range of Optional Functions

TOKYO--(BUSINESS WIRE)--Hitachi High-Technologies Corporation (TSE: 8036) (Hitachi High-Tech) announced the development of the Enhanced Microwave ECR*1 Etching Module (the “Module”), a new product designed for next-generation semiconductor device manufacturing processes. The module mounts onto the 9000-Series Conductor Etch System, one of Hitachi High-Tech’s conductor etch platforms and supports the development and mass production of cutting-edge semiconductor devices at 7 nm and beyond.

In the past few years, semiconductor devices evolved toward higher performance, driven by changes in transistor structures, such as FinFET*2, the commercialization of new memory techniques such as 3D-NAND, and the growing complexity of etching processes such as multi-patterning*3 technology. This evolution is accompanied by an increase in the number of etching application processes. In this environment, there has been a need for a high-performance system capable of etching at the atomic and molecular levels to support semiconductor devices in the 7 nm generation and beyond.

Hitachi High-Tech’s Conductor Etch System generates a stable plasma*4 in the high-vacuum, low-pressure regime and uses the microwave ECR method capable of performing low-damage etching. The newly designed Module is an etch chamber based on a new structure that dramatically improves the exhaust capacity for reaction byproducts*5 that inhibit etching. Moreover, by optimizing the position of the magnetic-field coil, Hitachi High-Tech achieves high-precision etching that selectively controls only the thin film to be etched at the atomic and molecular levels from among the multiple thin films on which patterns will be formed, all in conjunction with maintaining low-damage etching capability.

Optional functionality of the Module includes:

・an Integrated Pulse Control Function*6:


Controlling the generation of plasma and the replacement of gas within the etch chamber, thereby further enhancing etching precision.



・Plasma Distribution Control Function:

This function improves the magnetic coil configuration and enables more accurate control of the position where the etching plasma is generated using microwave electric field control technology, which optimizes the propagation of microwaves in the etch chamber. The combined effects enhance etching precision across the entire wafer.



・The Multi-Temperature Control Function:

A function designed to control the temperature of the stage on which the wafer rests by separating the stage into several zones. This allows for a uniform etching speed, which varies with temperature, across the entire wafer.

Hitachi High-Tech delivers high-precision etching capabilities through the wide range of functions available with this Module. By doing so, Hitachi High-Tech will continue to provide innovative solutions in a timely manner to address a diverse array of customer needs for the development and mass production of semiconductor devices. In parallel, Hitachi High-Tech contributes to cutting-edge manufacturing by pursuing and creating new value together with its customers.


ECR(Electron Cyclotron Resonance: Applying a magnetic field to a vacuum system starts a rotational motion of electrons called cyclotron motion centered at the magnetic field lines in the magnetic field. When microwave energy with frequency (ω) matching the rotation speed is made incident, energy resonance occurs between the cyclotron motion and the electric field, and the electric field energy is absorbed by the electrons. This is called electron cyclotron resonance. It effectively accelerates electrons and can apply a large amount of energy. The plasma that is generated with the energy applied in this way is called ECR plasma.


FinFET(Fin-shaped Field Effect Transistor: A field effect transistor with a 3D-type construction


Multi-patterning: A technique for forming fine circuit patterns through repeated, multiple exposures

*4 Plasma: A group of charged particles that is kept almost electrically neutral as a whole. The ions with a positive charge and electrons with a negative charge are distributed equally in an ionized state.
*5 Reaction byproducts: By-products generated by chemical reactions between reaction gases used in etching and the materials being etched.
*6 Integrated Pulse Control Function: A function that controls the timing of factors such as the generation of plasma, the replacement of reaction gases, and the detachment and emission of reaction products.


Yuichi Miura
Semiconductor Manufacturing Equipment Div.
Electronic Device Systems Business Group
For Media Inquiries
Emi Sato, Shota Sano
CSR & Corporate Communications Dept.,
CSR Div.
TEL: +81-3-3504-5001

Toshiba Expands New Packaging Option for SO6L IC-Output Photocouplers

- New products realize direct replacement from current SDIP6(F type) package products

TOKYO--(BUSINESS WIRE)--Toshiba Electronic Devices & Storage Corporation (“Toshiba”) is expanding its line-up of SO6L IC-output photocouplers with a new wide leadform package[1] type SO6L(LF4). Shipments start today.

The SO6L(LF4) package has a creepage distance of 8mm, which meets the industry’s standard creepage distance for SO6L.

To date, Toshiba has offered eight photocouplers in the SO6L(LF4) package: three for high-speed communication applications and five for IGBT/MOSFET drive applications. Now the company has added six photocouplers in the SO6L(LF4) package to its product portfolio: three for high-speed communication applications and three for IGBT/MOSFET drive applications.

The SO6L(LF4) package is footprint-compatible with the SDIP6(F type) package with wide lead-forming option and a maximum package height of 4.15mm. In addition, the SO6L(LF4) package has a maximum height of 2.3mm, which is approximately 45% thinner than the conventional SDIP6(F type) package. Its low profile package contributes to system size reduction and can be mounted in height-restricted locations, such as the back of a board.

Toshiba will release more IC-output photocouplers as direct replacements for the current SDIP6 (F type) package.

The latest Gartner market report recognizes Toshiba as the leading manufacturer of optocouplers by sales in 2015 and 2016, with 23% of sale-based market share in CY2016. (Source: Gartner “Market Share: Semiconductor Devices and Applications Worldwide 2016” 30 March, 2017)

Toshiba will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.


  • High-speed communication photocoupler
    (Factory networking, digital interfaces, I/O interface boards, programmable logic controllers (PLCs), intelligent power module drive [2] etc.)
  • IGBT / MOSFET driver photocoupler
    (General-purpose inverters, air-conditioner inverters, photovoltaic power inverters, etc.)


  • Package height: 2.3mm (max) [1.85mm lower than SDIP6(F type) (45% reduction)]
  • Pin distance [3]: 9.35mm (min) [pin-compatible with SDIP6(F type)

Main Specifications

(The characteristic values are guaranteed under temperature ranges shown below;
@Ta=-40 to 125℃ for TLP2710(LF4), TLP2766A(LF4)
@Ta=-40 to 110℃ for TLP2745(LF4), TLP2748(LF4), TLP5771(LF4), TLP5772(LF4), TLP5774(LF4)
@Ta=-40 to 100℃ for TLP2719(LF4) )


New part

[Package: SO6L(LF4)]


Current part number
[Package: SDIP6(F type)]

  Applications   Characteristic(new products)

Supply current


Threshold input
(L -> H)


Propagation delay time
tpLH, tpHL


Peak output


transient immunity
Min @Ta=25℃




0.3[5] 1.0 250



TLP2745(LF4) TLP715F 3 1.6 120



TLP2748(LF4) TLP718F 3 1.6[6] 120 -


TLP2719(LF4)[4] TLP719F TBD





TLP2766A(LF4)[4] TLP2766F 3 3.5[6] 40



TLP5771(LF4) TLP701AF


3 2 150



TLP5772(LF4) TLP700AF 3 2 150





    3   2   150  




Item   Package name
SO6L(LF4)   SDIP6(F type)
Height max (mm) 2.3 4.15
Creepage distances min (mm) 8 8
Clearance distances min (mm) 8 8
Isolation voltage

BVS@Ta=25℃ (kVrms)

  5   5

[1] A package with a longer pin distance than a standard package.
[2] Applicable part numbers: TLP2710(LF4), TLP2745(LF4), TLP2748(LF4)
[3] Pin distance: The span between pins on the LED and the pins on the photodetector.
[4] Under Development
[6] IFHL

Follow the link below for more on the new products and Toshiba’s photocoupler line-up.

Customer Inquiries:
Optoelectronic Device Sales & Marketing Dept.
Tel: +81-3-3457-3431

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

About Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation combines the vigor of a new company with the wisdom of experience. Since becoming an independent company in July 2017, we have taken our place among the leading general devices companies, and offer our customers and business partners outstanding solutions in discrete semiconductors, system LSIs and HDD.

Our 19,000 employees around the world share a determination to maximize the value of our products, and emphasize close collaboration with customers to promote co-creation of value and new markets. We look forward to building on annual sales now surpassing 700-billion yen (US$6 billion) and to contributing to a better future for people everywhere.
Find out more about us at


Media Inquiries:
Toshiba Electronic Devices & Storage Corporation
Chiaki Nagasawa, +81-3-3457-4963
Digital Marketing Department

NTT Communications’ SD-WAN Gives McLaren Racing an Edge for 2018 Season

WOKING, United Kingdom & TOKYO--(BUSINESS WIRE)--McLaren Formula 1 TEAM (McLaren), a pioneering leader in Formula 1 motor racing for more than 50 years, and NTT Communications Corporation (NTT Com), the ICT solutions and international communications business within the NTT Group (TOKYO:9432), announced today that McLaren will adopt SD-WAN (software-defined wide-area network) technology from NTT Com to connect the McLaren Technology Centre with racing circuits in 21 countries during the 2018 season. The decision follows a successful test deployment of the technology during the 2017 Japan Grand Prix, when McLaren was able to send 100GB of data during a race from Japan to the UK via NTT Com’s SD-WAN.

NTT Com’s SD-WAN uses software to control the WAN, providing McLaren with quick, secure, reliable and flexible management of data traffic flows. A variety of traffic can be sent via different connections, such as internet, mobile and MPLS, depending on time, priority and current network speed. This flexibility allows the priority routing of key data, such as telemetry and video, at critical points. Also, NTT Com’s service includes a dashboard screen to visualize data-traffic status during a race. McLaren can grasp network availability and required data bandwidth at a glance to optimize data transmission during a race, giving them an edge in the real-time formation, adjustment and deployment of in-race strategy.

Dr. Shin Miyakawa, Vice President, IoT Office / McLaren Taskforce was particularly pleased with the genesis and evolution of the project. “One of our R&D engineers attended a pre-season practice in Barcelona in 2017 and noticed occasional video jitter on screens in a garage, which made him wonder about the data bottlenecks causing the problem. At his suggestion, we tested our SD-WAN during the Suzuka 2017 race and the results were very successful. We engineered a solution for the 2018 season that McLaren will now use across the team. I’m very pleased with the success of our technology partnership.”

During a keynote speech at the Mobile World Congress in February 2018, two-time F1 world champion Fernando Alonso spoke about the growing importance of data for both machine and driver performance: “Each car provides more data every single second than you can imagine. Every single movement we do in the car, every steering wheel input, every throttle input, every brake pressure input is transmitted immediately in real time to the engineers in the garage.”

“Technology is such an important part of racing,” said Zak Brown, Executive Director of McLaren Technology Group. “SD-WAN is one of a number of marginal gains we are seeing from our technology partnership with NTT Communications. Because SD-WAN offers us more control over data flows during crucial moments, it gives us an edge. I also think it proves the willingness of our Technology Partners to deliver, to bring their expertise to the party, with the ultimate goal of driving the team faster.”

For more about NTT Communications SD-WAN, or to contact us:

Attachemnt1. Secure ICT Infrastructure
Attachemnt2. Race Schedule for 2018 Season

About McLaren Formula 1 TEAM

New Zealand racing driver Bruce McLaren founded the McLaren racing team in 1963. Since 1966, when it entered its first Formula 1 race, McLaren has won 20 world championships and over 180 grands prix. It has also won the Le Mans 24 Hours and the Indy 500 the two biggest races in the world.

Since those early days, the McLaren Technology Group has developed into one of international sport’s most successful competitors, become a globally renowned automotive manufacturer, and earned recognition as one of the most illustrious high-technology brands in the world.

The McLaren team campaigns the 2018 FIA Formula 1 World Championship with double-world champion Fernando Alonso and Stoffel Vandoorne.

They drive the McLaren-Renault MCL33.

About NTT Communications Corporation

NTT Communications provides consultancy, architecture, security and cloud services to optimize the information and communications technology (ICT) environments of enterprises. These offerings are backed by the company’s worldwide infrastructure, including the leading global tier-1 IP network, the Arcstar Universal One™ VPN network reaching over 190 countries/regions, and over 140 secure data centers worldwide. NTT Communications’ solutions leverage the global resources of NTT Group companies including Dimension Data, NTT DOCOMO and NTT DATA. | Twitter@NTT Com | Facebook@NTT Com | LinkedIn@NTT Com


For more information
McLaren Technology Group
Mr. Tim Bampton
Group Communications Director
NTT Communications Corporation
Mr. Ryu Kanishima
Technology Development

Investment in Insurtech Industry Surged in 2017, with Europe Emerging as Key Insurtech Hub, Accenture Analysis Finds

But consumers won’t experience benefits of technology until insurers rethink their innovation strategy

LONDON & NEW YORK & HONG KONG--(BUSINESS WIRE)--Global investment in the insurance technology (insurtech) industry surged in 2017, with Europe emerging as a new insurtech hub outside the U.S., according to new research from Accenture (NYSE: ACN).

The research, which includes new analysis of CB Insights data on insurtech deals over the last year, appears in a new Accenture report titled “Fearless Innovation: Insurtech as the Catalyst for Change Within Insurance.”

According to the report, the number of insurtech deals increased 39 percent globally in 2017, with the total value of deals up 32 percent, to US$2.3 billion.

While North America still leads in terms of both the total value and number of deals – accounting for US$1.24 billion, or 46 percent of deals last year – the number of deals there grew only 6 percent in 2017. In Europe, however, the number of deals increased 118 percent, accounting for one-third of all insurtech deals globally, and the total value of deals there jumped an astounding 385 percent, to US$679 million. Asia-Pacific saw a significant increase in funding, with a 169 percent rise in deal values, to US$358 million, with the number of deals rising 27 percent.

Despite the uncertainty around the U.K.’s vote to leave the European Union, the nation continues its emergence as Europe’s insurtech capital, with 41 deals in 2017, representing total growth of 117 percent over the last two years. Deal values vastly increased in 2017, with US$364 million invested in UK-based insurtechs, up from US$19 million the year before.

The report argues that insurtech should serve as a catalyst for innovation across the insurance industry, but traditional insurers must recognize that collaborating with insurtech startups is just one part of this process. Ultimately, innovation needs to become engrained throughout their organizations.

“The insurtech industry’s rapid growth reflects investors’ response to consumer appetite for change in an industry sitting on trapped value,” said Roy Jubraj, Accenture's UK and Ireland Insurance Strategy and Innovation lead. “At the same time, however, insurers must recognize that insurtech investments alone can’t deliver the levels of change and innovation the industry requires or that its customers expect. The key is having an enterprise-wide innovation strategy that transforms the core business and enables the company to drive growth.”

The research reveals that property and casualty was the most popular insurance segment for insurtech investments in 2017, accounting for 42 percent of global investments, with multiline (26 percent) and health (18 percent) rounding out the top three. Personal lines accounted for more than two-thirds (68 percent) of insurtech investments, with commercial lines and mixed applications accounting for 26 percent and 6 percent, respectively.

From a value chain perspective, marketing and distribution led all areas in terms of insurtech investment, accounting for more than half (53 percent) of deals globally. This is evident in the number of startups pitching slick, app-based sales and distribution experiences, as well as those improving the customer claims journey through mobile photo-evidencing or chatbot First Notification of Loss.

The report reveals that traditional insurers are quickly getting behind emerging technology companies, as the percentage of traditional insurers’ participating in venture capital investments is up 63 percent over the last five years. The most common areas for these investments were health and digital health (14 percent of such investments), the internet of things (13 percent), and big data and analytics (9 percent).

“Insurtech is no longer just a target for private equity and venture capital — it’s a global phenomenon,” said Michael Costonis, who leads Accenture’s Insurance practice globally. “Insurers are playing a big role in helping reshape the technology landscape across the industry, making investments beyond wearables and telematics to seize the opportunity that exists within distribution to strengthen the customer experience. The next step for insurers is to use insurtech as a springboard to innovate across their entire organization. After all, $2.3 billion is a small slice of the pie when you consider that insurance is a $4.2 trillion industry.”

Accenture analyzed insurtech investment data from CB Insights, a global venture-finance data and analytics firm. The analysis included global financing activity from venture-capital and private-equity firms, corporations and corporate venture-capital divisions, hedge funds, accelerators, and government-backed funds. The investment data ranged from 2010 through 2017 and included equity and non-equity financing.

About Accenture
Accenture is a leading global professional services company, providing a broad range of services and solutions in strategy, consulting, digital, technology and operations. Combining unmatched experience and specialized skills across more than 40 industries and all business functions – underpinned by the world’s largest delivery network – Accenture works at the intersection of business and technology to help clients improve their performance and create sustainable value for their stakeholders. With more than 435,000 people serving clients in more than 120 countries, Accenture drives innovation to improve the way the world works and lives. Visit us at


Natalie de Freitas, +44 7988165382
Michael McGinn, +1 917-452-9458

Home to the Cloud: e-shelter Continues to Expand and Announces It Will Open Another Data Center Campus in Frankfurt in Early 2019

New Data Center will offer up to 60MW IT load across 24.000 sqm of IT space

FRANKFURT, Germany & TOKYO--(BUSINESS WIRE)--e-shelter, a leading data center provider in Europe and an NTT Communications Group Company, has today announced the acquisition of new development site in Frankfurt, which will be its 4th location in the city.

The expansion comes on the back of strong customer demand in Frankfurt, as market leader, e-shelter already operates 3 sites across the city, including Europe’s largest data center campus, Frankfurt 1.

The “Frankfurt 4 Data Center” campus is located in Hattersheim in the west of the city and will feature 5 DC buildings built out in phases, with the first building of 9.7MW IT load scheduled to open in early 2019. Once fully built out, the site is capable of housing up to 60MW IT load and 24,000 sqm of IT space, supporting an average power density of 2.5 kW/sqm.

The new facility will follow e-shelter’s successful business model – offering both wholesale and retail colocation services, along with hybrid IT enterprise solutions and it will also fulfil NTT Communication’s Nexcenter™ global data center standards.

The “Frankfurt 4 Data Center” will offer flexible and scalable colocation space with high power density, carrier neutrality, cloud network access, connectivity and on-site support services, as well as on site first-class dedicated service personnel 24/7. Customers will be able to choose from flexible colocation deployments of single rack colocation and suites through to turnkey build to suit or shell & core solutions.

e-shelter currently operates across ten locations in the DACH region and a data center area of around 90,000 sqm. Outside of DACH e-shelter is also expanding to new markets with a new data center campus opening in Amsterdam in early 2019 and development sites secured in both Madrid and London.

The essential specifications of the new Frankfurt 4 Data Center campus include:

  • 60MW IT load capacity
  • 24,000 sqm IT space
  • Separate emergency power supply and
  • Average power density of 2,5 kW/sqm

About e-shelter

e-shelter is one of the leading data center operators in Europe providing highly secure environments for housing and connectivity of IT and network systems. With a presence in all key city-markets of the DACH-region, e-shelter leverages 300 MW of power capacity to deliver scalable data center solutions. As a subsidiary of NTT Communications, e-shelter is part of a global network of over 140 data centers and over 400,000 sqm of data center space. Among e-shelter’s clients are financial services companies, telecoms operators, public sector, IT service and outsourcing providers as well as cloud service providers.

In addition to e-shelter, the companies Arcadin, Dimension Data, itelligence, NTT Communications, NTT DATA and NTT Security are part of the NTT Group in Germany. In this region, the NTT Group represents around 5,300 employees and a revenue of more than €1.2 billion the NTT Group. You can find further information on the global NTT Group at

About NTT Communications Corporation

NTT Communications provides consultancy, architecture, security and cloud services to optimize the information and communications technology (ICT) environments of enterprises. These offerings are backed by the company’s worldwide infrastructure, including the leading global tier-1 IP network, the Arcstar Universal One™ VPN network reaching over 190 countries/regions, and over 140 secure data centers worldwide. NTT Communications’ solutions leverage the global resources of NTT Group companies including Dimension Data, NTT DOCOMO and NTT DATA. | Twitter@NTT Com | Facebook@NTT Com | LinkedIn@NTT Com


For more information
NTT Communications Corporation
Hiroshi Seo
Cloud Services
Claudia Isabel Knoll
Head of Marketing

Samsung Enables Premium Multimedia Features in High-End Smartphones With Exynos 7 Series 9610

The Exynos 9610 supports deep learning-based visual processing and 480 fps slow-motion recording

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the availability of its latest application processor (AP), the Exynos 7 Series 9610. The Exynos 9610, built on Samsung’s 10-nanometer (nm) FinFET process, elevates the multimedia experience in high-end smartphones with premium-level features such as deep learning-based image processing for ultimate picture-taking experiences and stunning slow motion video recording at 480 frames per second (fps).

“The Exynos 7 Series 9610 is our latest mobile processor that delivers on added power and speed,” said Ben Hur, vice president of System LSI marketing at Samsung Electronics. “But more importantly, it sets a new performance standard for high-end devices with its deep learning vision-image processing solution and slow motion video capabilities that change the way we engage with our mobile devices.”

For more enriched photo-taking and filming experiences, the Exynos 9610 delivers a major boost in multimedia performance. Vision and image processing is now coupled with a neural network engine for more intelligently enhanced face detection, as well as single camera out-focusing and augmented low-light images. The advanced face detection feature enables the camera to recognize faces that are either not facing forward or partially covered with objects like hair or a hat. With smart depth sensing, bokeh or out-focused portraits can be taken with a single camera. Through cleverly merging multiple frames, vision and image processing enhances the signal-to-noise ratio (SNR) and brightness that can improve pictures taken in low-light environments.

The Exynos 9610 also allows for 480fps slow-motion support in full HD. Even while using a conventional two-stack image sensor, the Exynos 9610 is able to encode slow-motion video, thanks to its image signal processor (ISP) with improved performance by 1.6 times and more-than-doubled mobile industry processor interface (MIPI) interface speed. In addition, the processor uses a premium multi-format codec (MFC) that allows encoding and decoding up to 4K 120fps.

With its powerful CPU and GPU, the Exynos 9610 provides smooth mobile computing and gaming performances that meet the needs of today’s high-end smartphones .The CPU is comprised of four Cortex-A73 cores running at 2.3 gigahertz (GHz), and four 1.6GHz Cortex-A53 cores to load apps quickly and run multiple tasks simultaneously. The GPU is a second-generation Bifrost-based ARM Mali-G72 that can bring more realistic and immersive graphics on mobile devices.

Always-on sensing applications that require instant feedback, such as gesture recognition or context awareness, are enabled by an embedded Cortex-M4F-based low-power sensor hub, which efficiently manages the sensors in real-time without waking the main processor.

For always connected and seamless mobile broadband connection, the embedded all-network LTE modem supports Cat.12 3CA (carrier aggregation) at 600 megabits per second (Mbps) for downlink and Cat.13 2CA at 150Mbps for uplink. The processor is also packed with wireless communication technologies such as high-throughput 802.11ac 2x2 MIMO Wi-Fi, faster and longer range Bluetooth 5.0, and FM for radio. In addition, for global location positioning coverage, it embeds a 4-mode Global Navigation Satellite System (GNSS) receiver that includes GPS (Global Positioning System), GLONASS, BeiDou and Galileo.

The Exynos 7 Series 9610 is expected to be mass produced in the second half of this year.

For more information about Samsung’s Exynos products, please visit

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at


Samsung Semiconductor, Inc.
Lisa Warren-Plungy, 408-544-5377

Capco Further Expands APAC Presence with Bangkok Office Opening

Firm continues to grow APAC business with sixth office in the region

BANGKOK--(BUSINESS WIRE)--Capco, a leading management and technology consultancy focused on the financial services industry, is pleased to announce the opening of its office in Bangkok.

The firm entered the Asia Pacific market in 2014 with the opening of an office in Hong Kong, and subsequently expanded its footprint in the region with offices in Singapore, Kuala Lumpur, Bangalore and Pune. This office, headed by Jon de Potter, is Capco’s sixth in the region.

Lance Levy, Chief Executive Officer of Capco, said “Capco continues to expand in Asia to meet the growing demand from financial services companies for the services we provide - innovative solutions that help companies leverage technology to transform their businesses.”

Thailand’s financial services market is evolving rapidly. Our Bangkok office has been established in response to banks’ increasing investment in digital products and solutions, as well as their increased focus on Risk and Regulatory management. With our consultancy base in the region flourishing, we plan to aggressively expand the Bangkok office to serve our growing list of regional financial services clients,” said Neil Ramchandran, Head of Capco’s Asia Pacific business.

About Capco

Capco is a global management and technology consultancy dedicated to the financial services industry. Our professionals combine innovative thinking with unrivalled industry and domain expertise to offer our clients consulting expertise, complex technology and package integration, transformation delivery, and managed services, to move their organizations forward. Through our collaborative and efficient approach, we help our clients successfully innovate, increase revenue, manage risk and regulatory change, reduce costs, and enhance controls. We serve our clients from offices in leading financial centers across the Americas, Europe, and Asia Pacific. To learn more, visit, and follow Capco on LinkedIn, Twitter or Facebook.



Richard Creswell
+ 44 7841 345427

Komatsu Deploys Box to More Than 10,000 Staff for Cloud Content Management

TOKYO--(BUSINESS WIRE)--Box, Inc. (NYSE:BOX), a leader in cloud content management, today announced that Komatsu is moving its workforce to Box. Komatsu is a leader in manufacturing and the sale of construction and mining equipment, utilities, forest machines and industrial machinery. Since March 2017, Komatsu has already deployed Box to more than 10,000 employees to power content management in the cloud.

“At Komatsu we constantly strive for innovation, not only in our products and services but also in the technology we provide our staff,” said a Komatsu spokesperson. “Box allows us to centralize our work across multiple locations and teams including customers and business partners, and deliver improved collaboration, speed, and security for our most important content.”

“Komatsu is a global company with almost a century of manufacturing expertise,” said Katsunori Furuichi, K.K. Box Japan president and managing director. “By choosing Box, Komatsu is enabling thousands of employees to work in smarter and more collaborative ways. We’re thrilled that Box can help power Komatsu’s next 100 years of content management.”

Komatsu chose Box in March 2017 to enable secure internal and external collaboration across multiple countries. Box is today helping disparate offices and staff to work together on projects, and provide a central point for content to be accessed, shared and worked on in the cloud.

Box makes it easy for more than 82,000 organisations around the world to share, access, and collaborate on files securely, including enterprises like AstraZeneca, General Electric, P&G, Schneider Electric, and more.

Download images and logos here:

About Box

Box (NYSE:BOX) is the cloud content management company that empowers enterprises to revolutionize how they work by securely connecting their people, information and applications. Founded in 2005, Box powers more than 82,000 businesses globally, including AstraZeneca, General Electric, P&G, and The GAP. Box is headquartered in Redwood City, CA, with offices across the United States, Europe and Asia. To learn more about Box, visit


Titus Thomson, +44(0)7598029952

Asia-Pacific Online Payment Methods: Second Half 2017 –

DUBLIN--(BUSINESS WIRE)--The "Asia-Pacific Online Payment Methods: Second Half 2017" report has been added to's offering.

Asia-Pacific Online Payment Methods: Second Half 2017, among other findings, points to the rapid rise in popularity of payment by digital wallets throughout the Asia-Pacific region. The publication covers the payment preferences of shoppers in 10 nations of the vast Asia-Pacific area.

Third-party online and mobile wallets are growing in popularity in China and India and spreading through other countries of the region. Research cited in the report shows that Alipay, WeChat Pay, Paytm and similar services made up nearly half of online retail payments in the Asia-Pacific region. Traditional plastic card remains the leading payment method for B2C E-Commerce in Japan, South Korea and Australia, but now accounts for only a little over 25% of online sales in the region as the electronic methods used in emerging markets shift the shares.

Digital wallets are used not only in online shopping, but also increasingly in brick and mortar stores. While cash is still the leader in all retail shopping in Asia, electronic wallets are second, and share second place with plastic for in-store shopping, according to a survey summarized in the report.

Questions Answered in this Report

  • How is the digital payments landscape evolving across Asia-Pacific?
  • What were the market shares of the top payment methods in Asia-Pacific E-Commerce in 2017?
  • How do online payment method preferences vary between 10 major markets of this region?
  • What is the current state and prospects of mobile payments in Asia-Pacific?
  • What are the leading mobile wallets in the countries of this region?

Key Topics Covered:

1. Management Summary

2. Global Developments

3. Asia-Pacific

Companies Mentioned

  • Ant financial services
  • Apple
  • China UnionPay
  • Kakao
  • Line
  • MasterCard
  • Mobikwik
  • Naver
  • Osaifu Keitai
  • PayPal
  • PayU
  • Paytm
  • Rakuten
  • Samsung
  • Tencent
  • True Corporation

For more information about this report visit

Laura Wood, Senior Manager
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: E-Business, Online Banking